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Issue title: Proceedings from the 16th International Symposium on Applied Electromagnetics and Mechanics (ISEM 2013)
Guest editors: Xavier Maldague and Toshiyuki Takagi
Article type: Research Article
Authors: Zeroukhi, Youcefa; b; * | Vega, Guillaumea; b | Juszczak, Ewa Napieralskaa; c | Morganti, Fabricea; c | Komeza, Krzysztofd
Affiliations: [a] Lille Nord de France, Lille, France | [b] Société Nexans NRC Lens, Bd de Marais, Lens, France | [c] LSEE, UA, Technoparc Futura, Béthune, France | [d] Institute of Mechatronics and Information Systems, Technical University of Lodz, Stefanowskiego, Poland | Université Laval, Canada | Tohoku University, Japan
Correspondence: [*] Corresponding author: Youcef Zeroukhi, Lille Nord de France, F-59000 Lille, France. E-mail: youcef.zeroukhi@nexans.com
Abstract: In this paper we propose a new method using finite elements modelling to predict the impact of stranding and compacting process on a conductor electrical resistance. The experimental work has highlighted the complexity of physical phenomenon within the conductor caused by elastic and plastic deformations and inters-strands electrical contact resistance. In reality, electrical performance of a conductor depends on the nature of the material and its metallurgical state, on the mechanical pressure and electrical conductance of inter-strands contact areas. For these reasons, mechanical models have been developed in Abacus software to study different parameters involved in the stranding and compacting process to determine the actual conductor shape, strands actual deformations, residual stresses and contact pressure, etc. The deformed geometries were exported to COMSOL Multi-physics software using ECAD IMPORT module. DC simulations were, then, performed to analyze the electrical resistance of the conductor. Finally, the results obtained by simulation have been compared to the measurements to determine the accuracy of the models.
Keywords: Finite elements modeling, compacting, conductor 1+6, hardening, resistivity, DC resistance
DOI: 10.3233/JAE-141821
Journal: International Journal of Applied Electromagnetics and Mechanics, vol. 45, no. 1-4, pp. 123-129, 2014
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