Effectiveness of using a magnetic compound fluid with a pulsed magnetic field for flat surface polishing

Issue title: Selected Papers from the 15th International Symposium on Applied Electromagnetics and Mechanics (ISEM 2011)

Article type: Research Article

Authors: Nishida, Hitoshi^{a; *} | Shimada, Kunio^b | Ido, Yasushi^c

Affiliations: [a] Toyama National College of Technology, Toyama, Japan | [b] Fukushima University, Fukushima, Japan | [c] Nagoya Institute of Technology, Nagoya, Japan

Correspondence: [*] Corresponding author: Hitoshi Nishida, Toyama National College of Technology, 13 Hongo, Toyama 939-8630, Japan. Tel.: +81 76 493 5439; Fax: +81 76 492 3859; E-mail: nishida@nc-toyama.ac.jp

Abstract: The effects of the frequency of a pulsed magnetic field on flat polishing were investigated to obtain basic data for increasing the performance and precision of polishing using MCFs. We clarified that the profile curves after polishing differ for a direct-current magnetic field and for a pulsed magnetic field and flattening occurred over a wide range when the frequency of a pulsed magnetic field is 0.1 Hz.

Keywords: Flat surface polishing, magnetic compound fluid, pulsed magnetic field, profile curve, magnetic cluster

DOI: 10.3233/JAE-2012-1520

Journal: International Journal of Applied Electromagnetics and Mechanics, vol. 39, no. 1-4, pp. 623-628, 2012