Delamination fracture mechanics of composite laminates with through‐thickness pinning

Issue title: International Conference on Complexity and Frontiers in Strength and Fracture (ICS 2001), Sendai, Japan, 24–27 June 2001 Part III (final part)

Article type: Research Article

Authors: Liu, Hong‐Yuan | Mai, Yiu‐Wing^{; ;}

Affiliations: Centre for Advanced Materials Technology, School of Aerospace, Mechanical and Mechatronic Engineering, The University of Sydney, Sydney, NSW 2006, Australia | MEEM, City University of Hong Kong, 83 Tat Chee Avenue, Kowloon, Hong Kong

Note: [] Corresponding author. Tel.: +852 2788 8307, +61 2 9351 2290; Fax: +852 2778 1906, +61 2 9351 3760; E‐mails: meywmai@cityu.edu.hk, ymai@mail.usyd.edu.au.

Abstract: A theoretical model has been developed to investigate the effects of through‐thickness pinning (z‐pin) on mode I delamination. Computer simulation results are presented to understand the mechanism of z‐pin reinforcement. Bridging force of the z‐pin is calculated by a single pin pull‐out model. Numerical results of the fracture load versus mode I delamination crack growth are obtained. Effects of the areal density, radius and Young's modulus of z‐pin are also studied. By assuming different interfacial friction coefficient, the effect of pin/laminates friction is discussed.

Keywords: Through‐thickness pinning, bridging force, z‐pin pull‐out, mode I delamination

Journal: Strength, Fracture and Complexity, vol. 1, no. 3, pp. 139-146, 2003