Residual Stress Variation in Polycrystalline Copper during Recrystallization

Article type: Research Article

Authors: Wierzbanowski, K. | Baczmański, A. | Wawszczak, R. | Bacroix, B. | Lodini, A.

Affiliations: WFiTJ, AGH University of Science and Technology, al. Mickiewicza 30, 30-059 Kraków, Poland | LPMTM-CNRS, Université Paris XIII, 99, av. J.B. Clement, 93 430 Villetaneuse, France | LACM, Université de Reims Champagne Ardenne, 9, bd. de la Paix, 51100 Reims, France

Note: [] Corresponding author. Fax: +48-126340010. E-mail: wierzbanowski@novell.ftj.agh.edu.pl

Abstract: A general multi-reflection method was applied to determine the stress level in deformed and recrystallized polycrystalline copper samples. Different reflections hkl were simultaneously used in the fitting procedure. The anisotropic diffraction elastic constants were calculated using the self-consistent model and crystallographic texture. Important decrease of the first order residual stresses was observed during recovery and recrystallization. Independently, diffraction peak widths and intensities were examined for a few characteristic texture components during the recrystallization process. The importance of cubic orientation grains in the recrystallization process was confirmed.

Keywords: Residual stress, Multireflection method, Recrystallization, Crystallographic texture, Peak width, Stored energy

DOI: 10.1080/10238160410001734685

Journal: Journal of Neutron Research, vol. 12, no. 1-3, pp. 201-205, 2004