Newly improved magnetic compound fluid (MCF) for more stability of particle dispersion

Issue title: Special Volume: Proceedings of the eleventh International Symposium on Applied Electromagnetics and Mechanics ISEM-Versailles ISEM 03

Article type: Research Article

Authors: Shimada, Kunio^{a; *} | Shuchi, Shigemitsu^a | Fujita, Toyohisa^b | Miyazaki, Toshio^b | Shibayama, Atsushi^b | Kamiyama, Shinichi^a

Affiliations: [a] Faculty of Systems Science and Technology, Akita Prefectural University, 84-4, Aza-Ebinokuchi, Honjyo, 015-0055, Japan | [b] Faculty of Engineering and Resource Science, Akita University, 1-1 Tegatagakuenmachi, Akita 010-8502, Japan

Correspondence: [*] Corresponding author. E-mail: shimada@akita-pu.ac.jp

Abstract: We experimentally investigated the relation of shear stress to shear rate of improved magnetic compound fluid (MCF) in engineering applications such as dampers and micro-polishing. The newly improved MCF is composed of smectite particles in a MCF previously developed by Shimada. In the new MCF, the particle distribution is more stable and the particles do not sediment. In the context micro-polishing, the relation of shear stress to shear rate in the newly improved MCF containing abrasive particles was investigated. The addition of the abrasive or smectite particles makes the shear stress change little in regard to changes in shear rate. Thus, the newly improved MCF can be applied to the micro-polishing of material surfaces at existing shear rates.

DOI: 10.3233/JAE-2004-589

Journal: International Journal of Applied Electromagnetics and Mechanics, vol. 19, no. 1-4, pp. 351-354, 2004