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Article type: Research Article
Authors: Lewis, Gladius; | Manickam, Saravanakumar | Wharton, Darrison
Affiliations: Department of Mechanical Engineering, The University of Memphis, Memphis, TN 38152, USA | Department of Biomedical Engineering, The University of Memphis, Memphis, TN 38152, USA
Note: [] Corresponding author. Please address request for reprints also to Dr. Gladius Lewis.
Abstract: The finite element analysis method was used to obtain values of the von Mises equivalent stress (SEQV) at selected locations within the adhesive layer of two-dimensional models of bonded orthodontic brackets. In all, 39 model cases were analyzed involving 4 overall bracket configurations, 3 combinations of materials of fabrication of the bracket, 3 types of debonding forces and 4 adhesives. The results are presented to show the sensitivity of SEQV to each of the parameters studied. Comments are made on the usefulness of the results in the development of a standard protocol for experimental determination of the bond strength of adhesives used in securing orthodontic brackets.
Keywords: Orthodontic bracket, debonding, adhesive layer, finite element stress analysis
DOI: 10.3233/BME-1996-6205
Journal: Bio-Medical Materials and Engineering, vol. 6, no. 2, pp. 113-121, 1996
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